Connect with us

The Plunge Daily

For the first time, TiE 'Global Summit' in India


For the first time, TiE 'Global Summit' in India

TiE Global Summit, which is aimed at entrepreneurs based out of the South Asia region, will be hosted in the Indian capital – New Delhi – on December 16-17, 2016. The summit has been designed to be India’s largest conference for all the key stakeholders including seasoned and serial entrepreneurs, investors and sponsors.

The two-day event will see informative sessions with marquee speakers, global investors and upcoming successful entrepreneurs who share their experiences and challenges. The TiE Global Summit 2016 will provide an opportunity for Entrepreneurs to learn from the speakers, new program like VC Connect, which has been created to connect entrepreneurs with multiple venture capitalists at a rapid pace.

Speaking on the announcement, Venktesh Shukla, Chairman TiE Global said, “The Summit will focus on promoting collaboration between Indian startups and successful start-ups in the USA, Europe and Asia especially China and sharing best practices from these markets. Initiatives like ‘Startup India’ reflect the maturing of the Indian ecosystem and there is a need to provide access to global resources to take it to the next level.”

Saurabh Srivastava, Chairman Emeritus of TIE Delhi-NCR and former TIE Global Board Member, added, “The TiE Global Summit is just what the doctor ordered. It will bring together successful entrepreneurs, mentors and savvy investors from India, Asia, the US and around the world, providing an invaluable opportunity for networking, sharing ideas and opportunities for collaborations between the best minds in India and abroad.”

Started in the year 1992 in Silicon Valley by a group of successful entrepreneurs, TiE has completed 25 years of fostering entrepreneurship across the world. On the occasion of the 25th anniversary, TiE has undertaken a new brand identity, which will be unveiled at the event.

Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *

To Top